Federal Announcements

The U.S. Department of Commerce’s Economic Development Administration is awarding a $1 million grant to the city of Luling, Texas, to support business growth and job creation through infrastructure improvements at the city’s industrial park. This grant will provide roadway, water, and broadband improvements to support business expansion in aerospace manufacturing and other industries, including meat and poultry processing.

The U.S. Department of Commerce’s Economic Development Administration is awarding a $500,000 grant to Ivy Tech Community College, Kokomo, Indiana, to help establish the Center of Excellence in Advanced Manufacturing. This project will provide autonomous robots and other equipment needed to help the Center prepare trainees for in-demand positions at regional manufacturing firms.

The Department of Defense released its Biomanufacturing Strategy, a document that will guide research efforts, industry partnerships, and relationships with allies in a rapidly developing technology field with significant implications for national security and economic competitiveness.

The U.S. Department of Commerce’s Economic Development Administration (EDA) is awarding a $2 million grant to Mid-State Technical College, Wisconsin Rapids, Wisconsin, to support the development of the College’s Advanced Manufacturing, Engineering Technology and Apprenticeship Center.

The Commerce Department released the notice of funding opportunity laying out the guardrails for companies applying to make major investments in the semiconductor industry in America, including a novel requirement that recipients craft a program tailored to the location to provide child care for all of their workers.

A team of researchers at the National Institute of Standards and Technology (NIST) and the University of Michigan devised a cybersecurity framework that brings digital twin technology together with machine learning and human expertise to flag indicators of cyberattacks. In a paper published in IEEE Transactions on Automation Science and Engineering, the researchers showed the feasibility of their strategy by detecting cyberattacks aimed at a 3D printer in their lab.

The U.S. National Science Foundation announced a cross-sector partnership with Ericsson, IBM, Intel, and Samsung to support the design of the next generation of semiconductors as part of its Future of Semiconductors (FuSe) initiative. Through this partnership activity, NSF will team with Ericsson, IBM, Intel, and Samsung to invest in projects that cultivate a broad coalition of science and engineering researchers to pursue holistic, “co-design” approaches.