Federal Announcements

The U.S. Department of Commerce’s Economic Development Administration is awarding a $2.5 million grant to the County of Oswego Industrial Development Agency in Oswego, New York, to support the growing manufacturing and semiconductor industries in the region.

The Department of Defense announced a $25.8 million award to Honeywell in Plymouth, Minnesota to produce or acquire trusted strategic radiation-hardened microelectronics. The funds will be used for strategic radiation-hardened microelectronics fabrication via a Defense Microelectronics Activity-accredited manufacturing process and support 90nm technology development in Honeywell's Minnesota microelectronics foundry.

Artificial Intelligence is transforming research, education, manufacturing and everyday life. To prepare the next generation of talent for a diverse, well-trained AI workforce, the U.S. National Science Foundation directorates for Computer and Information Science and Engineering (CISE) and STEM Education launched the NSF EducateAI initiative. This program aims to make state-of-the-art, inclusive AI educational experiences available nationwide.

The U.S. National Science Foundation announced a five-year investment of $104 million, with a potential 10-year investment of up to $208 million, in four new NSF Engineering Research Centers to create technology-powered solutions that benefit the nation for decades to come. The new centers will develop technologies to tackle the carbon challenge, expand physical capabilities, make heating and cooling more sustainable and enable the U.S. supply and manufacturing of natural rubber.

The Department of Defense recently announced seven additional awards to bioindustrial firms via the Distributed Bioindustrial Manufacturing Program (DBIMP). This announcement brings the DBIMP to 13 awards to date totaling $23 million.

The U.S. National Science Foundation and Intel Corporation announced a $7.6 million investment in six projects to advance equitable STEM education and training opportunities that strengthen the nation's semiconductor workforce.

The U.S. National Science Foundation, in partnership with Australia's national science agency, Commonwealth Scientific and Industrial Research Organisation, are investing in solutions that will accelerate the transition of materials development, manufacturing, and use to a circular economy, positively impacting multiple industries such as semiconductors and plastics.

The U.S. Department of Commerce and SK hynix have signed a non-binding preliminary memorandum of terms to provide up to $450 million in proposed federal incentives under the CHIPS and Science Act to establish a high-bandwidth memory (HBM) advanced packaging fabrication and R&D facility.

The Department of Defense today announced an additional five awards totaling $9 million for the Distributed Bioindustrial Manufacturing Program to expand the domestic supply of ingredients and materials for U.S. supply chains by building bioproduction infrastructure.

The U.S. National Science Foundation and the CHIPS for America Research and Development Office within the National Institute of Standards and Technology, a bureau of the U.S. Department of Commerce, signed a memorandum of understanding to jointly invest in a new initiative to train the future semiconductor workforce at all levels for myriad job types across industry and the nation.