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Federal Announcements

These federal announcements have been issued by a federal government agency related to the manufacturing industry. They include, but are not limited to, fact sheets, competition awards, and press releases. You can use the filters in the left-side column to find announcements of interest.

U.S. Department of Commerce Invests $2 Million to Support Educational Training for Advanced Manufacturing in Central Wisconsin

| Department of Commerce (DOC), Economic Development Administration (EDA) | Advanced Manufacturing, Apprenticeship, Technology, Workforce

The U.S. Department of Commerce’s Economic Development Administration (EDA) is awarding a $2 million grant to Mid-State Technical College, Wisconsin Rapids, Wisconsin, to support the development of the College’s Advanced Manufacturing, Engineering Technology and Apprenticeship Center.

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ICYMI: Experts Agree: Chips Manufacturing and National Security Bolstered by Childcare

| Department of Commerce (DOC), Executive Office of the President | Semiconductors, Workforce

The Commerce Department released the notice of funding opportunity laying out the guardrails for companies applying to make major investments in the semiconductor industry in America, including a novel requirement that recipients craft a program tailored to the location to provide child care for all of their workers.

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How Digital Twins Could Protect Manufacturers From Cyberattacks

| Department of Commerce (DOC), National Institute of Standards and Technology (NIST) | 3D Printing, Additive Manufacturing, Artificial Intelligence, Cybersecurity, Research and Development (R&D)

A team of researchers at the National Institute of Standards and Technology (NIST) and the University of Michigan devised a cybersecurity framework that brings digital twin technology together with machine learning and human expertise to flag indicators of cyberattacks. In a paper published in IEEE Transactions on Automation Science and Engineering, the researchers showed the feasibility of their strategy by detecting cyberattacks aimed at a 3D printer in their lab.

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NSF Announces Nearly $50 Million Partnership with Ericsson, IBM, Intel, and Samsung to Support the Future of Semiconductor Design and Manufacturing

| National Science Foundation (NSF) | Microelectronics, Semiconductors, Technology, Workforce

The U.S. National Science Foundation announced a cross-sector partnership with Ericsson, IBM, Intel, and Samsung to support the design of the next generation of semiconductors as part of its Future of Semiconductors (FuSe) initiative. Through this partnership activity, NSF will team with Ericsson, IBM, Intel, and Samsung to invest in projects that cultivate a broad coalition of science and engineering researchers to pursue holistic, “co-design” approaches.

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