Federal Announcements

The Biden-Harris Administration announced that the Department of Commerce and HP Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $50 million in proposed direct funding under the CHIPS and Science Act. The proposed funding would support the expansion and modernization of HP’s existing facility in Corvallis, Oregon, which is part of the company’s “lab-to-fab” ecosystem in the region.

The Biden-Harris Administration announced that the Department of Commerce and HP Inc. have signed a non-binding preliminary memorandum of terms to provide up to $50 million in proposed direct funding under the CHIPS and Science Act. The proposed funding would support the expansion and modernization of HP’s existing facility in Corvallis, Oregon, which is part of the company’s “lab-to-fab” ecosystem in the region that spans from R&D activities to commercial manufacturing operations.

The U.S. National Science Foundation announced a five-year investment of $104 million, with a potential 10-year investment of up to $208 million, in four new NSF Engineering Research Centers to create technology-powered solutions that benefit the nation for decades to come. The new centers will develop technologies to tackle the carbon challenge, expand physical capabilities, make heating and cooling more sustainable and enable the U.S. supply and manufacturing of natural rubber.

The Department of Defense recently announced seven additional awards to bioindustrial firms via the Distributed Bioindustrial Manufacturing Program (DBIMP). This announcement brings the DBIMP to 13 awards to date totaling $23 million.

The Biden-Harris Administration announced that the U.S. Department of Commerce and Texas Instruments (TI) have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $1.6 billion in proposed direct funding under the CHIPS and Science Act to strengthen domestic supply chain resilience, advance our national security, and bolster U.S. competitiveness in current-generation and mature-node semiconductor production.

The U.S. Department of Energy, through the Office of Manufacturing and Energy Supply Chains, announced $50 million for six states with significant automotive workforces to help small- and medium-sized suppliers adapt manufacturing facilities for the electric vehicle supply chain, helping to maintain good-paying, union jobs in traditional auto communities.

The U.S. National Science Foundation and Intel Corporation announced a $7.6 million investment in six projects to advance equitable STEM education and training opportunities that strengthen the nation's semiconductor workforce.

The U.S. Environmental Protection Agency announced its plan for implementing a new label program to boost clean American manufacturing by helping federal purchasers and other buyers find and buy cleaner, more climate-friendly construction materials and products.

The U.S. Department of Energy announced nearly $85 million across four heat pump manufacturers to accelerate the manufacturing of electric heat pumps, heat pump hot water heaters, and heat pump components at five factories in New York, Tennessee, Texas, and Rhode Island.

The U.S. Department of Energy announced a $2.2 billion investment in the nation’s grid for eight projects across 18 states to protect against growing threats of extreme weather events, lower costs for communities, and catalyze additional grid capacity to meet load growth stemming from an increase in manufacturing and data centers.